Recent Projects
ATE Boards
- T2K, V93K (Smartscale, Portscale.) Direct Dock, Wafer Sort, Vertical Probe Technologies, Integra/Micro/Ultra flex.
- Full size, 16 sites, 250 mils thick, 56 layers, 5500 components
- High speed TMDS and RF signals.
- Loopback RX/TX signals.
- Operating frequency upto 40GHz.
5G Applications
- Signal Integrity and Power Integrity Simulations
- 0.4mm pitch BGA
- 40 mils thick
- EPAG Finish.
Smartphone designs
- 1.7”x0.4” formfactor,10 layers-ELIC
- 522 components, 5500 connections
- 287 pin BGA, 0.3mm pitch
- 50/85/100 Ohm Impedance requirement
- Multiple EMI shields
High Speed applications
- 1.1”x2”
- 56G high speed signals with antipads
- High speed TMDS and RF signals.
- S parameter extraction and 3d modeling
- 784 pin, 0.5mm pitch BGA
- 93 mils thick
Networking board:
- Multiple FPGAs (0.3mm, 0.35mm, 0.4mm pitch.) 1724 pin, 1446 pin, 289 pin
- 484 56G-signals with antipads
- 26 Layers – 120 mils thick
- SI simulations.
- Controlled impedance and Relative propagation delay / length matching for all high-speed signals with tight tolerance.
Power supply board
- 60A DC current
- 4Oz Cu inner layers
- Multiple heatsinks, thermal spokes for heat dissipation
- Identify hotspots