Sample Designs

Design Capabilities:
  • 15 years of experience in designing test boards for leading ATE test system Vendor's Tester Platforms.
  • Experience in working with ATE board Fab house and Assembly.
  • Highly experienced with Commercial board designs and Test board designs for Analog, High Speed Digital, Mixed Signal, RF signals up to 40 GHz.
  • Experience in designs requiring leading interface technologies such as USB 2.0, USB 3.0, HDMI, UART, I2C,  PCI, PCIe, SATA, SAS, DDR 2, DDR3, Ethernet PHY Interface/Serdes, and more.
  • Experience in handling PCB materials such as FR4, Nelco, Rogers 4350B, Megtron 6 and many more.
  • Stack up optimization for high layer count PCBs (60 layers) and experience in handling Multiple Impedance control (50/90/100 ohm) on the same board.
  • Experience with fine pitch BGA (0.4mm) and multiple high pin count FCBGAs.
  • Specialized in commercial high speed and high layer count designs with multiple FBGAs including Processors, Memory units, High speed interfacing units, Controllers, Power modules/heat sinks and multiple IO interface ports/connectors.
  • We have been providing services for various that include Consumer Electronics, Semiconductor Industries, Telecommunications, Medical, Aero-space and Military applications.
T2K Final Test board
  • Full Test board: 16 SITES.
  • Total components: 5500
  • Layers: 40.
  • Board Thickness: 0.250 INCH.
  • Controlled impedance and Relative propagation delay / length matching for all high speed signals with tight tolerance.
T2K Probe card
  • 6 SITES and a DUT socket interface.
  • Layers: 36.
  • Board Thickness: 0.250 INCH.
  • Material: FR4.
  • High speed TMDS and RF signals.
  • Length matching for all the controlled impedance signals.
V93K Load Board
  • Octal SITES.
  • Loopback RX/TX signals.
  • Operating frequencies: 12Gbps.
  • High speed TMDS signals routed in micro-strip configuration and length matched.
  • Symmetrical placement and routing across all the 8 DUT’s.
  • Board Thickness: 0.165 INCH.
  • Material: Rogers.
  • Layers: 22.
  • Controlled impedance.
Commercial board design
  • High speed Digital and Analog design with 16 layers.
  • Major Interfaces: HDMI, Digital Video Interface (DVI), USB, UART and FPC Connectors.
  • I/O Standards: LVCMOS, LVDS, HSTL and PCI etc.
  • Design includes more than 800 components including 900 pin FBGA with 0.5mm pitch.
  • Multiple controlled impedance (50/90/100 Ohms).
  • Propagation delay/length matching.
Test Data
Test Data
Test Data
Test Data