Recent Projects

ATE Boards

  • T2K, V93K (Smartscale, Portscale.) Direct Dock, Wafer Sort, Vertical Probe Technologies, Integra/Micro/Ultra flex.
  • Full size, 16 sites, 250 mils thick, 56 layers, 5500 components
  • High speed TMDS and RF signals.
  • Loopback RX/TX signals.
  • Operating frequency upto 40GHz.

5G Applications

  • Signal Integrity and Power Integrity Simulations
  • 0.4mm pitch BGA
  • 40 mils thick
  • EPAG Finish.

Smartphone designs

  • 1.7”x0.4” formfactor,10 layers-ELIC
  • 522 components, 5500 connections
  • 287 pin BGA, 0.3mm pitch
  • 50/85/100 Ohm Impedance requirement
  • Multiple EMI shields

High Speed applications

  • 1.1”x2”
  • 56G high speed signals with antipads
  • High speed TMDS and RF signals.
  • S parameter extraction and 3d modeling
  • 784 pin, 0.5mm pitch BGA
  • 93 mils thick

Networking board:

  • Multiple FPGAs (0.3mm, 0.35mm, 0.4mm pitch.) 1724 pin, 1446 pin, 289 pin
  • 484 56G-signals with antipads
  • 26 Layers – 120 mils thick
  • SI simulations.
  • Controlled impedance and Relative propagation delay / length matching for all high-speed signals with tight tolerance.

Power supply board

  • 60A DC current
  • 4Oz Cu inner layers
  • Multiple heatsinks, thermal spokes for heat dissipation
  • Identify hotspots